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WLCSP Probe Head


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WLCP Probe Heads

Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.

Semiconductor Test

Kelvin Probes

Smiths Interconnect has developed an innovative and robust spring probe technology for Kelvin contact applications down to 0.35mm pitch.

Volta 180 Series Probe Head

Volta 180 Series Probe Head

Volta Series probe heads offer a high performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.