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Smiths Interconnect is the premier designer and manufacturer of test solutions for the semiconductor test market. Our sockets and probe card products utilize IDI contact technology to provide unsurpassed quality and reliability in testing applications.

We are a pioneer in semiconductor contact technology with products supporting bandwidths up to 40 GHz and on pitches as fine as 200 microns.

Our engineering development and expertise allow us to support automated, system level and development platforms for area array and peripheral packages as well as wafer level, strip, and package on package (3D) test. Our assemblies are built by the high quality standards found in all of our products and have proved to be highly effective in meeting the needs of the Semiconductor markets.

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