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Volta 180 Series Probe Head


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Volta 180 Series Probe Head
  • Suited for pitches 180 µm and above
  • High degree of parallelism
  • High density
  • Stable c-res over 750K cycles
  • Excellent co-planarity

The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.

Volta Series probe cards have exceptional DC and RF performance, enabling functional test at wafer level. They are cost-effective and easy to maintain. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.

 Volta 180Volta 200Volta 250Volta 300Volta 350Volta 400
Wafer I/O Pitch180 μm200 μm250 μm300 μm350 μm400 μm
Minimum Probe Depth
(At Test)
2.85 mm2.85 mm2.90 mm3.80 mm3.50 mm2.90 mm
Probe TravelWafer Side230 μm230 μm250 μm250 μm300 μm300 μm
PCB Side170 μm170 μm150 μm150 μm150 μm150 μm
Spring Materialmusic wiremusic wiremusic wirestainless steelstainless steelstainless steel
Device Side Contact MaterialHomogenous
Probe Tip Shape4-Point Crown
Spring Force6.5 gf10 gf15 gf17.5 gf16 gf17 gf
Contact Resistance< 200 mΩ< 250 mΩ< 100 mΩ< 100 mΩ< 70 mΩ< 50 mΩ
Continuous Current Carrying Capacity (Room Temp.)0.84 A1.2 A1.5 A2 A2.50 A3 A
Insertion Loss
(Pattern: R-S-R @ -1 dB)
20 GHz22 GHz30 GHz20 GHz20 GHz20 GHz
Loop Inductance0.65 nH0.56 nH0.76 nH0.95 nH0.92 nH0.82 nH
Capacitance0.40 pF0.22 pF0.31 pF0.39 pF0.41 pF0.30 pF
Working Temperature-55° to120°C-55° to 120°C-55° to 120°C-55° to 150°C-55° to 150°C-55° to 150°C
Max. Number of Test SitesDefined by the FEA [Total pin count at a defined area is the limit]
Sorted Die Test Feature (Alignment Plate and Manual Actuator)Yes
Individual Contact ReplacementYes