- Suited for pitches 180 µm and above
- High degree of parallelism
- High density
- Stable c-res over 750K cycles
- Excellent co-planarity
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Volta 180 Series Probe Head
The Volta Series Probe Head addresses a need for reduced test time set-up and increased throughput in high reliability testing of Wafer Level Packages (WLP), Wafer Level Chip Scale Packages (WLCSP) and Known Good Die (KGD) at 180 µm pitch and higher.
Volta Series probe cards have exceptional DC and RF performance, enabling functional test at wafer level. They are cost-effective and easy to maintain. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.
Volta 180 | Volta 200 | Volta 250 | Volta 300 | Volta 350 | Volta 400 | ||
---|---|---|---|---|---|---|---|
Wafer I/O Pitch | 180 μm | 200 μm | 250 μm | 300 μm | 350 μm | 400 μm | |
Minimum Probe Depth (At Test) |
2.85 mm | 2.85 mm | 2.90 mm | 3.80 mm | 3.50 mm | 2.90 mm | |
Probe Travel | Wafer Side | 230 μm | 230 μm | 250 μm | 250 μm | 300 μm | 300 μm |
PCB Side | 170 μm | 170 μm | 150 μm | 150 μm | 150 μm | 150 μm | |
Spring Material | music wire | music wire | music wire | stainless steel | stainless steel | stainless steel | |
Device Side Contact Material | Homogenous | ||||||
Probe Tip Shape | 4-Point Crown | ||||||
Spring Force | 6.5 gf | 10 gf | 15 gf | 17.5 gf | 16 gf | 17 gf | |
Contact Resistance | < 200 mΩ | < 250 mΩ | < 100 mΩ | < 100 mΩ | < 70 mΩ | < 50 mΩ | |
Continuous Current Carrying Capacity (Room Temp.) | 0.84 A | 1.2 A | 1.5 A | 2 A | 2.50 A | 3 A | |
Insertion Loss (Pattern: R-S-R @ -1 dB) |
20 GHz | 22 GHz | 30 GHz | 20 GHz | 20 GHz | 20 GHz | |
Loop Inductance | 0.65 nH | 0.56 nH | 0.76 nH | 0.95 nH | 0.92 nH | 0.82 nH | |
Capacitance | 0.40 pF | 0.22 pF | 0.31 pF | 0.39 pF | 0.41 pF | 0.30 pF | |
Working Temperature | -55° to120°C | -55° to 120°C | -55° to 120°C | -55° to 150°C | -55° to 150°C | -55° to 150°C | |
Max. Number of Test Sites | Defined by the FEA [Total pin count at a defined area is the limit] | ||||||
Sorted Die Test Feature (Alignment Plate and Manual Actuator) | Yes | ||||||
Individual Contact Replacement | Yes |