- 适用于最小引脚间距(pitch)180µm及以上测试
- 可以满足在750,000次寿命测试下仍保持低且稳定的电阻
- 卓越的针头共面性可满足64 个工位,5000根探针同时进行测试
- 模组化的针头设计能确保维护时可进行快速更换,停机时间几乎为零
- 全探针阵列设计允许现场根据不同产品配置探针位置
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Volta 晶圆级芯片封装探针头
史密斯英特康的浮动弹簧探针设计具有高度精确度,因此能在测试晶圆级芯片封装尺寸时实现无缝部署。
史密斯英特康已面向各类应用生产了数以千计的探针头。在晶圆级别测试Volta产品线,我们增加了针对更小引脚间距测试的的晶圆尺寸,晶圆级芯片封装(WLCSP)和已知合格芯片的Volta180系列。
Volta180 系列探针卡具有优越的直流电和射频性能,提高了探针头的使用寿命和延长单次正常运行时间,并且易于维护。
Volta 180 | Volta 200 | Volta 250 | Volta 300 | Volta 350 | Volta 400 | ||
---|---|---|---|---|---|---|---|
Wafer I/O Pitch | 180 μm | 200 μm | 250 μm | 300 μm | 350 μm | 400 μm | |
Minimum Probe Depth (At Test) |
2.85 mm | 2.85 mm | 2.90 mm | 3.80 mm | 3.50 mm | 2.90 mm | |
Probe Travel | Wafer Side | 230 μm | 230 μm | 250 μm | 250 μm | 300 μm | 300 μm |
PCB Side | 170 μm | 170 μm | 150 μm | 150 μm | 150 μm | 150 μm | |
Spring Material | music wire | music wire | music wire | stainless steel | stainless steel | stainless steel | |
Device Side Contact Material | Homogenous | ||||||
Probe Tip Shape | 4-Point Crown | ||||||
Spring Force | 6.5 gf | 10 gf | 15 gf | 17.5 gf | 16 gf | 17 gf | |
Contact Resistance | < 200 mΩ | < 250 mΩ | < 100 mΩ | < 100 mΩ | < 70 mΩ | < 50 mΩ | |
Continuous Current Carrying Capacity (Room Temp.) | 0.84 A | 1.2 A | 1.5 A | 2 A | 2.50 A | 3 A | |
Insertion Loss (Pattern: R-S-R @ -1 dB) |
20 GHz | 22 GHz | 30 GHz | 20 GHz | 20 GHz | 20 GHz | |
Loop Inductance | 0.65 nH | 0.56 nH | 0.76 nH | 0.95 nH | 0.92 nH | 0.82 nH | |
Capacitance | 0.40 pF | 0.22 pF | 0.31 pF | 0.39 pF | 0.41 pF | 0.30 pF | |
Working Temperature | -55° to120°C | -55° to 120°C | -55° to 120°C | -55° to 150°C | -55° to 150°C | -55° to 150°C | |
Max. Number of Test Sites | Defined by the FEA [Total pin count at a defined area is the limit] | ||||||
Sorted Die Test Feature (Alignment Plate and Manual Actuator) | Yes | ||||||
Individual Contact Replacement | Yes |