Smiths Interconnect is delighted to announce a strategic partnership with Tempe, Arizona-based Phoenix Test Arrays. The collaboration between the two companies will deliver Silmat® Elastomeric Test Sockets to the global semiconductor test industry.
Silmat® Elastomeric Test Sockets provide reliable signal integrity with high durability, long life and field replaceable test contacts. Both partners are confident this advanced, low profile contact technology will provide customers with a competitive edge in Package on Package (PoP) top socket and digital high speed test applications. The new product range will be available over the next few months with launch events in the United States, Europe and Asia.
Gabriel Guglielmi, Smiths Interconnect Vice President of Business Development and Strategy said, “I’m very excited about our partnership with PTA. Both companies have recognized strengths and expertise which complement each other. Our collaborative relationship with a valued technology partner like PTA enhances our ability to help our global customer base successfully deal with the rapidly evolving requirements in the high-speed and PoP segments of the semiconductor test industry.”
“The strategic partnership with Smiths Interconnect speaks volumes in addressing a specific need in the marketplace,” said Tony Smith, President and CEO of Phoenix Test Arrays. “Silmat® elastomeric contact technology is a sophisticated, high performance solution and I’m confident the market will value the best-in-class design and testing capabilities that this alliance will deliver.”
Smiths Interconnect is delighted to announce a strategic partnership with Tempe, Arizona-based Phoenix Test Arrays. The collaboration between the two companies will deliver Silmat® Elastomeric Test Sockets to the global semiconductor test industry.
Silmat® Elastomeric Test Sockets provide reliable signal integrity with high durability, long life and field replaceable test contacts. Both partners are confident this advanced, low profile contact technology will provide customers with a competitive edge in Package on Package (PoP) top socket and digital high speed test applications. The new product range will be available over the next few months with launch events in the United States, Europe and Asia.
Gabriel Guglielmi, Smiths Interconnect Vice President of Business Development and Strategy said, “I’m very excited about our partnership with PTA. Both companies have recognized strengths and expertise which complement each other. Our collaborative relationship with a valued technology partner like PTA enhances our ability to help our global customer base successfully deal with the rapidly evolving requirements in the high-speed and PoP segments of the semiconductor test industry.”
“The strategic partnership with Smiths Interconnect speaks volumes in addressing a specific need in the marketplace,” said Tony Smith, President and CEO of Phoenix Test Arrays. “Silmat® elastomeric contact technology is a sophisticated, high performance solution and I’m confident the market will value the best-in-class design and testing capabilities that this alliance will deliver.”
