DesignCon, the United States’ premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.
As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will feature a comprehensive portfolio of our star test products, highlighting solutions engineered for the next generation of technology in AI PCs, Enterprise Data Centres (EDC), automotive electronics, and the Internet of Things (IoT).
Spotlight on Innovation: DaVinci Gen V High-Speed Test Socket
Headlining the display will be the DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centres, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.
Product Features:
- Solution for BGA, LGA and other variants
- Spring probe technology using homogeneous alloy with gold plating for better grounding
- RF bandwidth > 84 GHz @ -1dB IL
- Short signal path 4.90 mm test height
- Impedance tuned to match system
- Consistent stable contact resistance 55 mΩ (Avg.)
- Hi-coplanarity accommodation
- Tri-temp socket design to support -55 °C to +150 °C
- Designed for manual test, bench test, and HVM production test using the same socket
High-Power Burn-In Test Socket
Smiths Interconnect’s high-power burn-in socket is a specialised electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator, or high-power discrete component) to a test board for the burn-in and stress testing phase of manufacturing.
Its primary function is to provide a robust, reliable, and often automated connection that can withstand extreme conditions far beyond normal operation, specifically:
- To support next-generation devices (up to 22,000 contacts, 150x150mm)
- Capable of managing up to 2000W of power with integrated liquid cooling
- Universally compatible with all advanced burn-in chamber platforms
- Designed to deliver a 500lb applied load with a maximum closing force of 15lb.
- Flexible thermal options including passive heatsinks and heat pipes
This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.
Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies firsthand and engage with technical experts.
DesignCon, the United States’ premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.
As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will feature a comprehensive portfolio of our star test products, highlighting solutions engineered for the next generation of technology in AI PCs, Enterprise Data Centres (EDC), automotive electronics, and the Internet of Things (IoT).
Spotlight on Innovation: DaVinci Gen V High-Speed Test Socket
Headlining the display will be the DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centres, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.
Product Features:
- Solution for BGA, LGA and other variants
- Spring probe technology using homogeneous alloy with gold plating for better grounding
- RF bandwidth > 84 GHz @ -1dB IL
- Short signal path 4.90 mm test height
- Impedance tuned to match system
- Consistent stable contact resistance 55 mΩ (Avg.)
- Hi-coplanarity accommodation
- Tri-temp socket design to support -55 °C to +150 °C
- Designed for manual test, bench test, and HVM production test using the same socket
High-Power Burn-In Test Socket
Smiths Interconnect’s high-power burn-in socket is a specialised electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator, or high-power discrete component) to a test board for the burn-in and stress testing phase of manufacturing.
Its primary function is to provide a robust, reliable, and often automated connection that can withstand extreme conditions far beyond normal operation, specifically:
- To support next-generation devices (up to 22,000 contacts, 150x150mm)
- Capable of managing up to 2000W of power with integrated liquid cooling
- Universally compatible with all advanced burn-in chamber platforms
- Designed to deliver a 500lb applied load with a maximum closing force of 15lb.
- Flexible thermal options including passive heatsinks and heat pipes
This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.
Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies firsthand and engage with technical experts.
- Last： 史密斯集团与莫仕达成协议出售史密斯英特康业务
