
- Substrates - Alumina
- Commercial and High Reliability Product Lines
- Frequency Range from 16 to 36 GHz
- Attenuation Values from 1 to 10dB
- Space Qualified
- Surface mount or bondable configurations
- RoHS options available
The KFA is a high frequency, wire bondable chip attenuator. Designed with the KTVA footprint in mind this component offers a flat attenuation from 16-36 GHz. The KFA chip attenuator can handle 200mW and is available in 1 -10 dB with an operating temperature from -55 to +150 ºC. The KFA is also available for high-reliability applications under the HRKFA part number with Group A, B and C life testing according to Mil-PRF-55342. This attenuator is available with gold wire bondable terminals and a platinum silver, solder attachable ground plane in an ultra miniature chip size 0.065 x 0.120 inches (1.65mm x 3.05mm).
KFA-SMTF series is one of our latest millimeter wave products. Providing the same high performance as the wire bondable series in a surface-mountable package, KFA-SMTF is compatible with high-speed automated assembly process. The unique attenuator design ensures high performance repeatability and high tolerance to assembly variability.Our K-band attenuators have been incorporated into various commercial wireless and high reliability applications, including point-to-point radios and satellite communication systems.
KFA Series Chip Attenuators | ||
Package Style | ||
Surface-Mount | Wire-Bondable | |
Operating Frequency | 18.0 - 36.0 GHz | 16.0 - 36.0 GHz |
Impedance | 50 Ω | |
VSWR, Typical | 1.35 | |
Power Handling | 200 mW | |
Operating Temperature | -55ºC to 150ºC | |
Size | 3.05 mm x 1.65 mm | |
Substrate | Alumina | |
Resistive Material | Thick Film | |
Terminal Material | Thick Film | |
Terminal Finish (Link to Data Sheet) | Solder Plated | Wire-Bondable Gold |
Silver / Nickel |