KFA Series Chip Attenuators

The KFA is a high frequency, wire bondable chip attenuator. Designed with the KTVA footprint in mind this component offers a flat attenuation from 16-36 GHz. The KFA chip attenuator can handle 200mW and is available in 1 -10 dB with an operating temperature from -55 to +150 ºC. The KFA is also available for high-reliability applications under the HRKFA part number with Group A, B and C life testing according to Mil-PRF-55342. This attenuator is available with gold wire bondable terminals and a platinum silver, solder attachable ground plane in an ultra miniature chip size 0.065 x 0.120 inches (1.65mm x 3.05mm).

KFA-SMTF series is one of our latest millimeter wave products. Providing the same high performance as the wire bondable series in a surface-mountable package, KFA-SMTF is compatible with high-speed automated assembly process. The unique attenuator design ensures high performance repeatability and high tolerance to assembly variability.Our K-band attenuators have been incorporated into various commercial wireless and high reliability applications, including point-to-point radios and satellite communication systems.

	KFA Series Chip Attenuators
	Package Style
	Surface-Mount	Wire-Bondable
Operating Frequency	18.0 - 36.0 GHz	16.0 - 36.0 GHz
Impedance	50 Ω
VSWR, Typical	1.35
Power Handling	200 mW
Operating Temperature	-55ºC to 150ºC
Size	3.05 mm x 1.65 mm
Substrate	Alumina
Resistive Material	Thick Film
Terminal Material	Thick Film
Terminal Finish (Link to Data Sheet)	Solder Plated	Wire-Bondable Gold
	Silver / Nickel

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