Burn-In Test

We offer an extensive catalog of finished sockets that are ready to fulfill burn-in, humidity, failure analysis, and test requirements for the latest packaged devices, including QFN, LGA, BGA and μBGA.

We control the entire process to give customers a high-quality, cost-effective socket solution with a quick turnaround.

Whether your package matches perfectly with a socket in our current catalog, or you need a custom product for your innovation, Plastronics has the technology and the expertise to determine and deliver the right solution for you.