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CVD Diamond Terminations

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CVD Diamond Terminations
  • Frequency Range from DC to 26.5 GHz
  • Extreme High Power to Size Ratings
  • Peak Power Performance
  • Small Size and Weight
  • Power Handling up to 300 Watts
  • CVD Diamond Substrates
  • Tuned Versions Available
  • Solderable or Bondable Gold Terminals
  • Integrated Heat Sink
  • Tab Launch
  • Surface Mount Available
  • Tape and Reel Packaging Available
  • High Reliability Versions Available

Smiths Interconnect|EMC's exclusive line of CVD Diamond terminations offers a unique combination of extreme high power ratings in very small packages. These terminations may be used in applications from DC to 26.5 GHz and are ideal for applications requiring high power capability and small, light-weight package size. The Diamond chip terminations are manufactured using all thin film construction and have a gold finish that is both wire bondable and solderable. This total thin film construction also makes them ideal for peak power applications. The “T” units have a gold plated copper tab for ease of installation. The “FT” series units are equipped with a gold plated copper tab and integrated heat sink for ease of mounting.

Because of their total thin film construction they are ideal for peak power applications.  Standard chip and high reliability tested versions based on Mil-PRF-55342 are also available. Select from tape and reel or waffle packaging. These products are lead free, RoHS complaint and S-level approved.

 CVD Diamond Terminations
 CT0402DCT0505DCT0603DCT0603DW2
Package StylePlanar / BondablePlanar / BondablePlanar / BondableSurface-Mount Chip
Operating FrequencyDC - 26.5 GHzDC - 20.0 GHzDC - 28.0 GHzDC - 18.0 GHz
Impedance50 Ω
VSWR, Typical1.301.601.601.2 ?
Power Handling10 W50 W50 W30 W
Operating Temperature-55ºC to 150ºC
Size1.14 mm x 0.64 mm1.40 mm x 1.40 mm1.68 mm x 0.89 mm1.66 mm x 0.89 mm
SubstrateCVD Diamond
Resistive MaterialThin Film (Tantalum Nitride)
Terminal MaterialGold / Nickel
Data Sheet1011105101052510115351013405

 

 CT1310DCT2010DCT0505DTBCT1310DT
Package StylePlanar / BondablePlanar / BondableTabbed ChipTabbed Chip
Operating FrequencyDC - 14.0 GHzDC - 12.4 GHzDC - 20.0 GHzDC - 14.0 GHz
Impedance50 Ω
VSWR, Typical1.401.3?1.601.50
Power Handling125 W300 W50 W125 W
Operating Temperature-55ºC to 150ºC-55ºC to 125ºC
Size3.33 mm x 2.67 mm5.21 mm x 2.67 mm1.42 mm x 1.42 mm3.30 mm x 2.67 mm
SubstrateCVD Diamond
Resistive MaterialThin Film (Tantalum Nitride)
Terminal MaterialGold / Nickel
Data Sheet1010545101350510131751015435
  • Radar
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  • High Power Filters
  • High Power Amplifiers
  • Instrumentation
  • Isolators
  • Satellite Communications