Smiths Interconnect has developed an innovative and robust spring probe technology for Kelvin contact applications down to 0.35mm pitch.
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WLCSP Probe Head
WLCP Probe Heads
Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
Volta 180 Series Probe Head
Volta Series probe heads offer a high performance, cost-effective, easily maintainable alternative to cantilever and vertical probe card technologies.